Almit's lead-free solder paste and solder wire range embraces today's environmentally responsible manufacturing strategies while still including innovative formulations, such as Bismuth, for lower melting points with no mechanical disadvantage. Companies wishing to change to a lead-free solder should, in the short term, seriously consider Almit's LFM-48 Sn/Ag/Cu range of alloys. Alternatively, look at the addition of either Bismuth or Antimony, the choice being dependant on temperature or strength requirements. Overall, the Almit range of lead-free and low-lead alloys have superior mechanical properties than that of standard Sn/Pb. For more information View our Lead-Free Presentations by clicking on the links below. (Acrobat Reader required).
Lead-Free Paste Specifications
Code |
Composition |
Characteristics |
LFM-8 |
Sn/Ag/Cu/Bi |
• Melting point 219°c • Suitable for applications where assembly is reflow temperature sensitive |
LFM-22 |
Sn/Cu |
• Melting point 227°c • Suitable for surface mount assembly applications where both high speed and high reliability are desirable |
LFM-48 |
Sn/Ag/Cu |
• Melting range 217 - 220°c |
*
All products are available in a variety of particle sizes
and flux types dependant on the application |
Lead Free Wire Specifications
Code |
Composition |
Characteristics |
KR-19 SH RMA LFM-8 |
Sn/Ag/Cu/Bi |
• Melting point 219°c |
KR-19 SH RMA LFM-22 |
Sn/Cu |
• Melting point 227°c • Ideal for low residue hand soldering • No clean |
KR-19 SH RMA LFM-48 |
Sn/Ag/Cu |
• Melting range 217 - 220°c |
*All above wires available in 0.5mm to 1.6mm diameters * Almit specialises in cored wire for robotic soldering applications |